Semi-Automated Polishing Machine

Function. Performs small-scale polishing of thin-section chips in a semi-automated bench unit.

Controlled. Plate speed; polishing time.

Measured. Polished surface finish.

Sample size, pressure ratings, wetted materials, tooling and instrumentation are configured per project. Guaranteed performance and included hardware are stated only in the project-specific technical proposal and approved datasheet.

Features

• Variable speed: 10 to 600 RPM
• Specimen size: 30x45mm or 1 x 1.5 inches
• Plate diameter: 250 mm Dimensions:526 x 589 x 380 mm Weight: 50 kg Power supply: 220 VAC - 50/60 Hz

Benefits

• Free vibration at low speeds
• Polishs chips or thin sections
• Easy access for rapid and effortless leaning
• Simultaneous polishing up to four samples