Manual Lapping, Grinding and Polishing Machine

Function. Performs small-scale lapping, grinding and polishing of specimens for low-volume preparation.

Controlled. Plate speed and applied load (manual).

Measured. Surface finish and thickness.

Sample size, pressure ratings, wetted materials, tooling and instrumentation are configured per project. Guaranteed performance and included hardware are stated only in the project-specific technical proposal and approved datasheet.

Features

• Variable speed: 10 to 600 RPM
• Specimen size: 30x45mm or 60x45 mm (other upon request)
• Plate diameter: 250 mm
• Dimensions:526 x 589 x 380 mm
• Weight: 50 kg
• Power supply: 220 VAC - 50/60 Hz

Benefits

• Vibration free at low speeds
• Easy accessibility for fast cleaning
• Manual lapping and grinding