Slicing, grinding and lapping machine LESGL200

The multi-purpose LESGL200 can slice, grind and lap specimens using only one instrument. A high grade steel lapping disc, diamond-cutting blade, diamond-grinding wheel, and versatile vacuum chuck for various slide sizes are the key components of the machine. The latter grasps the thin section during slicing and grinding operations.

The sample is directly transferred from the cutting blade to the grinding wheel, by virtue of a manually rotated wheel, thereby facilitating the procedure and saving time. An adjustable screw controls the slicing thickness while a precision micrometer monitors grinding thickness of thin section. Sample lapping consists of first manually holding the sample in place while a silicon carbide solution is periodically poured over the disc.