Automated lapping machine LELM500

The LELM500 is a bench floor single-plate lapping machine, utilized to flatten the chip face which will be glued to a slide and to perform the final thin section sample thickness reduction. The powerful apparatus can simultaneously process up to 6 chips or 24 thin sections, with an exceptionally high degree of surface finish.

By removing subsurface damage caused by sawing and grinding, the desired specimen thickness and evenness are achieved. The device is mainly composed of a rotating grooved cast iron plate, a chip lapping jig, a precision thin section lapping jig, a lapping thickness tuning tool, an unevenness correction rim and an abrasive fluid (e.g. silicon carbide) dispensing and recycling system. Via a control panel, the operator can manually control the apparatus or run it in the automatic mode.